A total of glory | UIT was invited to attend the Intel 2019 Partner Summit

2019-05-17

On May 14-16, the Intel 2019 Partner Summit was held at the Sydney International Convention and Exhibition Center. As Intel's top strategic partner, UW Vice President Bao Qingping was invited to attend and discuss with thousands of eco partners how to deploy Intel platform layout. New business opportunities to jointly look forward to the future that the smart connected world is reshaping.



The Intel 2019 Partner Summit is a global channel event hosted by Intel that is dedicated to building a smarter and more innovative ecosystem for partners.


At this Partner Summit, Intel demonstrated its products, technologies and solutions for the data center, including Intel Xeon 2nd generation scalable processors, Intel AoTeng and QLC 3D NAND technologies, helping partners to become closer together. System solution for market demand.


Intel Vice President and General Manager of China, Wang Rui (left) hosted the keynote speech at the summit


As the leading data center software, equipment and operation provider in China, UIT has maintained close cooperation and interaction with Intel in product development, technical support, solutions and market cooperation.


UIT Vice President Bao Qingping (left) and Intel Vice President and China General Manager Wang Rui took a group photo


During the meeting, UW Vice President Bao Qingping and Intel (United States and Asia Pacific) responsible for in-depth exchanges, and with the outstanding partners to discuss the current data center market conditions and future market trends.


In the future, UIT will continue to focus on the big data industry, and strive to break through innovation, deepen the cooperation relationship with Intel, and continue to enrich the innovative solutions and application cases in the fields of big data storage, cloud computing, edge computing, artificial intelligence, etc. Innovative technologies contribute to the development of the digital economy.


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